Method of manufacturing liquid crystal display device

ABSTRACT

In a method of manufacturing an LCD device, TFT unit cells are formed on a first mother substrate, and color filter unit cells are formed on a second mother substrate. A liquid crystal alignment film is formed on the TFT unit cells and on the color filter unit cells. The first mother substrate and the second mother substrate are assembled to form an assembled substrate and liquid crystal is disposed between the TFT unit cell and the color filter unit cell. An LCD unit cell is inspected by applying a test driving signal via non-contact method. The LCD unit cell is separated from the assembled substrate to form an LCD panel. A driving module and the LCD panel are assembled to be formed an LCD assembly.

CROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This application relies for priority upon Korean PatentApplication No.2002-72796 filed on Nov. 21, 2002, the contents of whichare herein incorporated by reference in its entirety.

BACKGROUND OF THE INVENTION

[0002] 1. Field of the Invention

[0003] The present invention relates to a method of manufacturing aliquid crystal display device, and more particularly to a method ofmanufacturing a liquid crystal display device having a reduced time formanufacturing the liquid crystal display device and an enhancedproductivity.

[0004] 2. Description of the Related Art

[0005] In general, a liquid crystal display device is lighter andsmaller in comparison with other display devices. The liquid crystaldisplay devices are manufactured via many manufacturing processes.

[0006] A first process for manufacturing the liquid crystal displaydevice includes forming thin film transistor (tft) unit cells on a firstmother substrate and forming color filter unit cells on a second mothersubstrate. One example of the first process for manufacturing the liquidcrystal display device is disclosed in U.S. Pat. No. 6,391,137 (entitled‘method for manufacturing display device’).

[0007] A second process for manufacturing the liquid crystal displaydevice includes a rubbing process. Liquid crystal layer disposed betweenthe thin film transistor unit cell and the color filter unit cell isaligned via the rubbing process on the thin film transistor unit cellsand the color filter unit cells. One example of the second process isdisclosed in U.S. Pat. No. 5,879,497 (entitled ‘Alignment Device andRubbing Cloth for Alignment with respect to Liquid Crystal DisplayDevice-use Substrate, and Method for Manufacturing a Liquid CrystalDisplay Device’). A cylindrical roller covered by a piled fabric (orrubbing cloth) having pile rolls on the alignment film, so that analignment groove is formed on the alignment film. The alignment groovecreates pre-tilt angles of liquid crystal molecules of the liquidcrystal layer.

[0008] One example of a third process for manufacturing the liquidcrystal display device is disclosed in the U.S. Pat. No. 6,397,137. Thethird process includes an assembly process for assembling the firstmother substrate and the second mother substrate. The first mothersubstrate and second mother substrate are assembled such that the thinfilm transistor unit cells of the first mother substrate face the colorfilter unit cells of the second mother substrate unit cell. Hereinafter,the first mother substrate and second mother substrate are referred toas an ‘assembled substrate’, and the thin film transistor unit cell andcolor filter unit cell are referred to as a ‘liquid crystal displaydevice unit cell’.

[0009] One example of a fourth process for manufacturing the liquidcrystal display device is disclosed in the U.S. Pat. No. 6,397,137. Thefourth process includes a scribe-and-break process for scribing andseparating the liquid crystal display device unit cells from theassembled substrate. One liquid crystal display device unit cellseparated from the assembled substrate is referred to as a ‘liquidcrystal display panel’.

[0010] A fifth process for manufacturing the liquid crystal displaydevice includes a test process. A test driving signal is applied to theliquid crystal display panel for testing the liquid crystal displaypanel.

[0011] A sixth process for manufacturing the liquid crystal displaydevice includes a liquid crystal injection process for injecting liquidcrystal into a cell gap disposed between the first mother substrate andthe second mother substrate, and cell gap modulating process formodulating the size of the cell gap.

[0012] A seventh process for manufacturing the liquid crystal displaydevice includes a polarizing plate attaching process and module process.A polarizing plate (or polarizing plates) is (are) attached on theliquid crystal display panel via the polarizing plate attaching process.A driving module for driving the liquid crystal display panel isinstalled on the liquid crystal display panel via the module process.Hereinafter, the liquid crystal display device having the driving moduleis referred to as a ‘liquid crystal display panel assembly’.

[0013] Generally, the sequence of the conventional manufacturingprocesses has been maintained, and the failures occurring during each ofthe processes has been reduced.

[0014] However, the conventional manufacturing processes has somecritical problems.

[0015] For example, a process speed of each of processes is differentfrom each other. In detail, a process speed of the first through thethird processes is different from that of the fourth through the seventhprocesses. In general, the process speed of the first through the thirdprocesses is faster than that of the fourth through the seventhprocesses. Namely, the process speed of the processes of manufacturingthe thin film transistor unit cell, the color filter unit cell and theassembled substrate is faster than the process speed of the scribeprocess, separation process, the test process, the liquid crystalinjection process, polarizing plate attaching process and the moduleprocess.

[0016] Therefore, the assembled substrate that has passed through thethird process should stand by for a predetermined time so as to undergothe fourth process. The longer the assembled substrate stands by, thelower is the productivity of the liquid crystal display device.

[0017] More equipment may be established in the fourth through theseventh processes in order to solve above problem. In other word,extensions of equipment may increase the productivity of the liquidcrystal display devices. However, the more equipment greatly increasesmanufacturing cost.

[0018] Further, the conventional manufacturing processes have manyproblems.

[0019] A first problem occurs in the rubbing process. The rubbingprocess for aligning the liquid crystal molecules has the followingproblem. The roller covered by a piled fabric having pile rolls on thealignment film, so that an alignment groove is formed on the alignmentfilm. The alignment groove creates pre-tilt angles of liquid crystalmolecules of the liquid crystal layer.

[0020] However, many particles are generated as a byproduct in theconventional rubbing process. The particles may induce failures duringthe rubbing process. In order to eliminate the particles, a cleaningprocess is needed. The cleaning process includes a chemical cleaningprocess in which chemical cleaning agent resolves the particles and theparticles are removed, a process for removing the chemical cleaningagent by pure water, and a dry process for removing the pure water.Accordingly, the time for manufacturing the liquid crystal displaydevice may be increased due to the cleaning process.

[0021] Further, according to the conventional rubbing process, therubbing cloth is replaced by a new rubbing cloth or the rubbing cloth iscleaned periodically. Therefore, the conventional rubbing process cannotbe successively performed and the efficiency of manufacturing the liquidcrystal display device is lowered.

[0022] Moreover, in the conventional rubbing process, the piled fabric(rubbing cloth) having pile forms alignment grooves on the alignmentfilm. Therefore, defects of the alignment grooves are seldom detected,when the alignment grooves are already formed. The defects of thealignment grooves may be detected in the reliability test of the liquidcrystal display device after the liquid crystal display device iscompletely manufactured. The liquid crystal display device having adefect of the alignment groove lowers image display quality.

[0023] A second problem occurs after the assembled substrate ismanufactured. When the assembled substrate is manufactured, the liquidcrystal display device unit cells are separated from the assembledsubstrate, and each of the liquid crystal display panels aremanufactured using each of the liquid crystal display device unit cells.Input terminals and (or) output terminals are exposed to the air, andthe input/output terminals are oxidized, so that a thin oxidation filmmay be formed on the surface of the input/output terminals. The thinoxidation film deteriorates electrical characteristics of theinput/output terminals. Therefore, display quality of the liquid crystaldisplay device is lowered.

[0024] A fourth problem occurs in the module process. Liquid crystal isinjected into liquid crystal display panel and a polarizing plate isattached onto the liquid crystal display panel. The polarizing plate isattached onto each of the liquid crystal display panels separated fromthe assembled substrate one by one. Therefore, much time is required soas to attach the polarizing plate onto the assembled substrate.

[0025] In order to overcome above problem, the polarizing plate may beattached onto the assembled substrate. Then, the polarizing plateattached onto the assembled substrate is cut off, so that a liquidcrystal display device unit cell having a polarizing plate on ismanufactured. However, it is hard to detect the defect of the liquidcrystal display device unit cell before cutting off the assembledsubstrate. When a polarizing plate is attached onto a defective liquidcrystal display unit cell, the polarizing plate is wasted.

SUMMARY OF THE INVENTION

[0026] Accordingly, there is provided a method of manufacturing a liquidcrystal display device, which provides an enhanced productivity formanufacturing the liquid crystal display device and a reduce time formanufacturing the liquid crystal display device.

[0027] According to one aspect of the method of this invention, a thinfilm transistor unit cell is formed on a thin film transistor unit cellregion of a first mother substrate, and a color filter unit cell isformed on a color filter unit cell region of a second mother substrate.A liquid crystal alignment film is formed on the thin film transistorunit cell and on the color filter unit cell. The first mother substrateand the second mother substrate are assembled to form an assembledsubstrate, such that the thin film transistor unit cell faces the colorfilter unit cell, and liquid crystal is disposed between the thin filmtransistor unit cell and the color filter unit cell. A liquid crystaldisplay unit cell including the thin film transistor unit cell and thecolor filter unit cell facing the thin film transistor unit cell isinspected by applying a test driving signal via non-contact method. Theliquid crystal display unit cell is separated from the assembledsubstrate to form a liquid crystal display panel. A driving module andthe liquid crystal display panel are assembled to be formed a liquidcrystal display panel assembly.

[0028] According to the present invention, a polarizing plate isattached onto an assembled substrate on which at least one liquidcrystal display unit cells are formed, the at least one liquid crystaldisplay unit cell are separated from the assembled substrate, a liquidcrystal display panel is manufactured, and a driving module is installedon the liquid crystal display panel, so that the time for manufacturingthe liquid crystal display device are reduced and the productivity ofmanufacturing the liquid crystal display device is enhanced.

[0029] According to the present invention, the alignment film is formedon the thin film transistor unit cell and on the color filter unit cellby a non-contact method. Therefore, time for forming the alignment filmis reduced and alignment of the liquid crystal molecules is improved.

[0030] According to the present invention, the assembled substrate isinspected whether the assembled substrate has defect or not before thepolarizing plate is attached to the assembled substrate. In case theassembled substrate has defect, the polarizing plate is not attached tothe assembled substrate.

[0031] According to the present invention, the liquid crystal displayunit cells are separated from the assembled substrate after thepolarizing plate is attached on the assembled substrate. Therefore, timefor attaching the polarizing plate to the liquid crystal display unitcells is reduced and the productivity for manufacturing the liquidcrystal display device is enhanced.

BRIEF DESCRIPTION OF THE DRAWINGS

[0032] The above and other features and advantages of the presentinvention will become more apparent by describing in detail theembodiments thereof with respect to the accompanying drawings, in which:

[0033]FIG. 1 is a flow chart showing a method of manufacturing a liquidcrystal display device according to a first exemplary embodiment;

[0034]FIG. 2 is a schematic view showing a first mother substrate andthin film transistor unit cell regions formed on the first mothersubstrate according to the first exemplary embodiment;

[0035]FIG. 3 is a schematic view showing a pixel electrode and a thinfilm transistor of a thin film transistor unit cell formed in the thinfilm transistor unit cell region of FIG. 2;

[0036]FIG. 4 is a cross-sectional view showing a pixel electrode and athin film transistor of FIG. 3;

[0037]FIG. 5 is a schematic view showing a second mother substrate andcolor filter unit cell regions formed on the second mother substrateaccording to the first exemplary embodiment;

[0038]FIG. 6 is a cross-sectional view showing a portion of a colorfilter unit cell of FIG. 5;

[0039]FIG. 7 is a cross-sectional view showing an alignment film formedon the first mother substrate or the second mother substrate accordingto the first exemplary embodiment;

[0040]FIG. 8 is a flow chart showing a method of aligning liquid crystalon an alignment film by a non-contact method according to the firstexemplary embodiment of the present invention;

[0041]FIG. 9 is a flow chart showing a method of generating a first ionbeam of FIG. 8;

[0042]FIG. 10 is a schematic diagram showing a non-contact alignmentdevice according to the first exemplary embodiment;

[0043]FIG. 11 is a schematic view showing a first ion beam generatingmodule, a second ion beam generating module and an atomic beamgenerating module of FIG. 10;

[0044]FIG. 12 is a schematic view showing a non-contact alignment deviceand a device for forming a diamond-like-carbon thin film;

[0045]FIG. 13 is a flow chart showing a method of aligning liquidcrystal by a non-contact method according to a second exemplaryembodiment;

[0046]FIG. 14 is a flow chart showing a method of forming a polarizedfunctional group in the diamond-like-carbon thin film according to thesecond exemplary embodiment;

[0047]FIG. 15 is a flow chart showing a process of introducing ahydroxyl radical (OH⁻) into the polarized functional group;

[0048]FIG. 16 is a flow chart showing a process of introducing ahydrogen ion into the polarized functional group according to a thirdexemplary embodiment of the present invention;

[0049]FIG. 17 is a flow chart showing a process of introducing anitrogen ion into the polarized functional group according to a fourthexemplary embodiment of the present invention;

[0050]FIG. 18 is a schematic view showing a non-contact alignment deviceaccording to a fifth exemplary embodiment of the present invention;

[0051]FIG. 19 is a schematic view showing a non-contact alignment deviceaccording to a sixth exemplary embodiment of the present invention;

[0052]FIG. 20 is a schematic view showing a non-contact alignment deviceaccording to seventh exemplary embodiment of the present invention;

[0053]FIG. 21 is a schematic view showing a non-contact alignment deviceaccording to a eighth exemplary embodiment of the present invention;

[0054]FIG. 22 is a flow chart showing a method for generating an atomicbeam according to a ninth exemplary embodiment of the present invention;

[0055]FIG. 23 is a schematic view showing an atomic beam generatingdevice according to a tenth exemplary embodiment of the presentinvention;

[0056]FIG. 24 is a flow chart showing a non-contact aligning method ofaligning liquid crystal molecule on an alignment film according toeleventh embodiment of the present invention;

[0057]FIG. 25 is a schematic view showing a non-contact alignment deviceaccording to a twelfth exemplary embodiment of the present invention;

[0058]FIG. 26 is a cross-sectional view showing a transparent thin filmformed on a mother substrate;

[0059]FIG. 27 is a cross-sectional view showing a carbon polymer formedon the transparent thin film of FIG. 26;

[0060]FIG. 28 is a flow chart showing a method for detecting unfilledregion in which the liquid crystal is not filled;

[0061]FIG. 29 is a schematic view showing an example of detecting devicefor detecting the unfilled region;

[0062]FIG. 30A is a flow chart showing a non-contact inspecting methodof inspecting the liquid crystal display unit cell;

[0063]FIG. 30B is a flow chart showing a method of driving the liquidcrystal display unit cell of FIG. 30A;

[0064]FIG. 30C is a flow chart showing a method of inspecting the liquidcrystal display unit cell of FIG. 30A;

[0065]FIG. 31 is a schematic view showing an example of a non-contactinspecting device;

[0066]FIG. 32 is a schematic view showing an example of an attachingdevice for attaching a polarizing plate to the liquid crystal displayunit cell;

[0067]FIG. 33 is a cross-sectional view showing a first motherpolarizing plate;

[0068]FIG. 34 is a cross-sectional view showing a second motherpolarizing plate;

[0069]FIG. 35 is a schematic view showing an example of a firstcutting-out module of FIG. 32

[0070]FIG. 36 is a schematic view showing a first (or second) motherpolarizing plate cut out by a first x-axis blade of FIG. 35;

[0071]FIG. 37 is a schematic view showing a first (or second) motherpolarizing plate cut out by a first y-axis blade after cut out by thefirst x-axis blade of FIG. 35;

[0072]FIG. 38 is a schematic view showing a first protection-sheet stripmodule of FIG. 32; and

[0073]FIG. 39 is a schematic view showing a polarizing plate attachingmodule of FIG. 32.

DESCRIPTION OF PREFERRED EMBODIMENTS

[0074] Hereinafter the preferred embodiment of the present inventionwill be described in detail with reference to the accompanying drawings.

[0075]FIG. 1 is a flow chart showing a method of manufacturing a liquidcrystal display device according to a first exemplary embodiment.

[0076] Referring to FIG. 1, at least one thin film transistor unit cellis formed on a first mother substrate, and at least one color filterunit cell is formed on a second mother substrate (step S100). The thinfilm transistor unit cell formed on the first mother substrate and thecolor filter unit cell formed on the second mother substrate are formedvia different process from each other.

[0077]FIG. 2 is a schematic view showing a first mother substrate andthin film transistor unit cell regions formed on the first mothersubstrate according to the first exemplary embodiment.

[0078] Referring to FIG. 2, at least one thin film transistor unit cellregions 20 is formed on the first mother substrate 10.

[0079] For example, a size of the first mother substrate 10 is about1600 mm×1400 mm. The first mother substrate 10 may includes a glasssubstrate that is transparent and has good heat-resisting property.

[0080] The thin film transistor unit cell region 20 is surrounded by adotted line. For example, six thin film transistor unit cell regions 20are formed on the first mother substrate 10. A thin film transistor unitcell 30 is formed in each of the thin film transistor unit cell regions20.

[0081]FIG. 3 is a schematic view showing a pixel electrode and a thinfilm transistor of a thin film transistor unit cell formed in the thinfilm transistor unit cell region of FIG. 2, and FIG. 4 is across-sectional view showing a pixel electrode and a thin filmtransistor of FIG. 3.

[0082] Referring to FIGS. 3 and 4, a thin film transistor unit cell 30includes at least one thin film transistor 40, a gate line 50, a dataline 60 and a pixel electrode 70.

[0083] For example, when a resolution of a liquid crystal display deviceis 1024×768, a number of the thin film transistors 40 formed on a thinfilm transistor unit cell region 20 of FIG. 2 are 1024×768×3. The thinfilm transistors 40 are arranged in a matrix shape on the thin filmtransistor unit cell region 20 of FIG. 2.

[0084] Referring to FIG. 4, the thin film transistor 40 includes a gateelectrode 42, a gate insulation layer 43, a source electrode 44, a drainelectrode 46 and a channel layer 48.

[0085] Referring again to FIG. 3, the gate line 50 is formed through thesame process of forming the gate electrode 42. The gate electrodes 42 ofthe thin film transistors 40 are electrically connected with each othervia the gate line 50.

[0086] The data line 60 is formed through the same process as in formingthe source electrode 44 and the drain electrode 46 of the thin filmtransistor 40. The source electrodes 44 of the thin film transistors 40are electrically connected with each other via the data line 60.

[0087] The pixel electrode 70 includes a material that has highlight-transmissivity and high electric conductivity. For example, thepixel electrode 70 includes indium tin oxide (ITO) or indium zinc oxide(IZO). One pixel electrode 70 are formed in each of the thin filmtransistor 40, and electrically connected with the drain electrode 46 ofthe thin film transistor 40.

[0088]FIG. 5 is a schematic view showing a second mother substrate andcolor filter unit cell regions formed on the second mother substrateaccording to the first exemplary embodiment.

[0089] Referring to FIG. 5, a size of the second mother substrate 80 isabout 1600 mm×1400 mm, for example. The second mother substrate 80 mayincludes a glass substrate that is transparent and has goodheat-resisting property.

[0090] A color filter unit cell region 90 is surrounded by a dotted linein FIG. 5. At least one color filter unit cell region 90 is formed onthe second mother substrate 80. For example, six color filter unit cellregions 90 are formed on the second mother substrate 80. A color filterunit cell 100 is formed in each of the color filter unit cell regions90.

[0091]FIG. 6 is a cross-sectional view showing a portion of a colorfilter unit cell of FIG. 5.

[0092] Referring to FIG. 6, a color filter unit cell 100 of FIG. 5includes a color filter 110 and a common electrode 120.

[0093] The color filter 110 includes a red-color filter 112, agreen-color filter 114 and a blue-color filter 116. The red-color filter112 filters white light, so that only light having a wavelengthcorresponding to a red-color visible light may pass through thered-color filter 112. The green-color filter 114 filters white light, sothat only light having a wavelength corresponding to a green-colorvisible light may pass through the green-color filter 114. Theblue-color filter 116 filters white light, so that only light having awavelength corresponding to a blue-color visible light may pass throughthe blue-color filter 116. Each of the red-color filter 112, the greencolor filter 114 and the blue color filter 116 faces the pixel electrode70 of FIG. 3.

[0094] The common electrode 120 includes a material that has goodlight-transmissivity and good electric conductivity. For example, thecommon electrode 120 includes indium tin oxide (ITO) or indium zincoxide (IZO). The common electrode 120 is formed on the color filter 110and formed in the entire region of the color filter unit cell region 90of FIG. 5.

[0095] Referring again to FIG. 1, after the thin film transistor unitcell 30 is formed on the first mother substrate 10, and the color filterunit cell 100 is formed on the second mother substrate 80, liquidcrystal molecules are aligned by a non-contact aligning method (stepS200). The molecular orientation of the liquid crystal is set bynon-contact aligning method.

[0096] The non-contact aligning method solves the problem that occurswhen the liquid crystal molecules are aligned by the conventionalrubbing process using a polyimide film as an alignment film.

[0097] The first mother substrate 10 including at least one thin filmtransistor unit cell 30 and the second mother substrate 80 including atleast one color filter unit cell 100 are erected to be disposed parallelto the gravitational force direction and transferred to a place wherenext process is carried out by auto guided vehicle (AGV) or manualguided vehicle (MGV).

[0098] The first mother substrate 10 and the second mother substrate 80has a large surface area, so that many problems such as sagging mayhappen due to the large surface area of the first mother substrate 10and the second mother substrate 80. Therefore, the first mothersubstrate 10 and the second mother substrate 80 are erected andtransferred so as to solve the problems. For example, when the firstmother substrate 10 and the second mother substrate 80 is laid down tobe disposed substantially perpendicular to the gravitational forcedirection and transferred, the first mother substrate 10 and the secondmother substrate 80 may sag due to the gravitational force, so thatpatterns formed on the thin film transistor unit cell 30 or on the colorfilter unit cell 100 is damaged and electrically shorted. This problemmay be solved when the first mother substrate 10 and the second mothersubstrate 80 are erected and transferred. When the first mothersubstrate 10 and the second mother substrate 80 are erected andtransferred, the sagging phenomenon of the first mother substrate 10 andthe second mother substrate 80 may be minimized.

[0099] Further, when the first mother substrate 10 and the second mothersubstrate 80 are erected and transferred, the air that flows from aceiling of a clean room toward a bottom of the clean room makes minimalcontact with the first mother substrate 10 and the second mothersubstrate 80. Therefore, a contamination of the first mother substrate10 and the second mother substrate 80 is minimized when the first mothersubstrate 10 and the second mother substrate 80 are erected andtransferred.

[0100] Moreover, in most of equipments for manufacturing a liquidcrystal display device, a substrate is erected and loaded into theequipments, and then the substrate is laid down to be disposedperpendicular to the gravitational force direction before the substrateundergo any process in the equipments. Therefore, additional time forerecting the substrate so as to load the substrate into the equipment isneedless when the substrate is transferred in an erected state.

[0101] Hereinafter, a non-contact aligning method and device foraligning the liquid crystal molecules are disclosed.

[0102] <First Embodiment of Non-Contact Type Alignment of Liquid CrystalMolecules>

[0103] In order to align liquid crystal molecules on the thin filmtransistor unit cell 30 of FIG. 2 or on the color filter unit cell 100of FIG. 5, an alignment film and atomic beam to be applied to thealignment film are needed.

[0104]FIG. 7 is a cross-sectional view showing an alignment film formedon the first mother substrate or the second mother substrate accordingto the first exemplary embodiment.

[0105] Referring to FIG. 7, an alignment film 130 includes adiamond-like-carbon thin film (DLC film) formed on surfaces of the thinfilm transistor unit cell and on the color filter unit cell. Thealignment film 130 may includes SiO₂, Si₃N₄ and TiO₂ aside from thediamond-like-carbon thin film.

[0106] Hereinafter, the diamond-like-carbon thin film is referenced bythe reference numeral 130.

[0107] The diamond-like-carbon thin film 130 is used as an alignmentfilm because the diamond-like-carbon thin film 130 has carbon-carbondouble bond

[0108] When the carbon-carbon double bond of carbon atoms is broken intoa carbon-carbon single bond, the carbon atoms have polarity to becomeradicals.

[0109] When liquid crystal molecules are disposed on thediamond-like-carbon thin film 130 including carbon radical, the liquidcrystal molecule is self-aligned due to the diamond-like-carbon thinfilm 130 including the carbon radical because the liquid crystalmolecule has both characteristics of crystal and liquid and has liquidcrystal molecular director that aligns in accordance with externalelectromagnetic field.

[0110] In the present embodiment, an atomic beam induces the carbonradicals on the surface of the diamond-like-carbon thin film 130. Apre-tilt angle affects the viewing angle of the liquid crystal displaydevice. When the pre-tilt angle of the liquid crystal molecules in afirst region of a liquid crystal display panel is different from that ofthe liquid crystal molecules in a second region of the liquid crystaldisplay panel, spots are shown on the liquid crystal display paneldisplays, to thereby provide inferior image display.

[0111] In case the atomic beam induces the carbon radicals on thediamond-like-carbon thin film 130, when an angle between the atomic beamand a surface of the diamond-like-carbon thin film 130 varies accordingas, the pre-tilt angle of the liquid crystal molecules changes.Therefore, irradiation angle (or scanning angle) of atomic beam isrelated with display quality.

[0112]FIG. 8 is a flow chart showing a method of aligning liquid crystalon an alignment film by a non-contact method according to the firstexemplary embodiment of the present invention.

[0113] Referring to FIG. 8, in order to align liquid crystal moleculeson a diamond-like-carbon thin film by a non-contact alignment method, afirst ion beam is generated (step S205).

[0114]FIG. 9 is a flow chart showing a method of generating a first ionbeam of FIG. 8.

[0115] Referring to FIG. 9, in order to generated a first ion beam, asource gas is supplied (step S206) and the source gas is dissociated tobe ions (step S207). Then, the ions are accelerated (step S208).

[0116] For example, an argon (Ar) gas is used as a source gas. The argongas may be dissociated into argon ions by plasma-generating electricfield or at a high temperature higher than about 2500K.

[0117] In the present embodiment, the argon gas is dissociated at atemperature higher than about 2500K.

[0118] When the source gas is dissociated and is transformed into ions,the ions of the source gas are accelerated toward the target (stepS208). When a voltage having opposite polarity to the polarity of theions is applied to the target, the ions of the source gas areaccelerated.

[0119] For example, the argon ions has positive (+) polarity, negative(−) voltage is applied to the diamond-like-carbon thin film so as toaccelerate the argon ions.

[0120] The argon ions are attracted toward the diamond-like-carbon thinfilm having negative (−) voltage in accordance with coulomb's law. Thelarger an absolute value of the voltage applied to thediamond-like-carbon thin film becomes, the faster are accelerated theargon ions.

[0121] When the first ion beam passes through an aperture of an ion beamgenerating device, an irradiation angle of the ion beam formed withrespect to a surface of the diamond-like-carbon thin film is controlled.A shape of the cross-section of the second ion beam depends on a shapeof the aperture of the ion beam-generating device.

[0122] However, when the first ion beam is directly applied to thediamond-like-carbon thin film, it is hard to control an irradiationangle of the first ion beam with respect to the diamond-like-carbon thinfilm.

[0123] Therefore, the first ion beam is transformed into a second ionbeam (step S210) as shown in FIG. 8.

[0124] The first ion beam is transformed into the second ion beam by anelectronic method or by a physical method. The second ion beam has aband shape that has a rectangular cross-section.

[0125] In order to generate the second ion beam having the above shape,the first ion beam is allowed to pass through a housing of which anentrance is broad and of which an outlet has a rectangular shape.

[0126] The angle of the second ion beam with respect to the surface ofthe diamond-like-carbon thin film determines the pre-tilt angle of theliquid crystal molecules. The angle of the second ion beam with respectto the surface of the diamond-like-carbon thin film is in a range fromabout 0° to about 90°. For example, when the liquid crystal is twistednematic liquid crystal, the angle of the second ion beam with respect tothe surface of the diamond-like-carbon thin film is in the range fromabout 0° to about 45°. When the liquid crystal is vertically aligned invertical alignment mode, the angle of the second ion beam with respectto the surface of the diamond-like-carbon thin film is in the range fromabout 45° to about 90°, preferably in the range from about 80° to about90°.

[0127] Referring again to FIG. 8, the second ion beam advancing towardthe diamond-like-carbon thin film 130 is transformed into an atomic beam(step S215). Direction and speed of the atomic beam are substantiallythe same as in the second ion beam.

[0128] Electrons are supplied to the second ion beam so that ions of thesecond ion beam are transformed into the source gas that is electricallyneutral. The ions of the second ion beam are very unstable. Therefore,the ions accept electron to be transformed into an atomic beam that iselectrically neutral and stable.

[0129] The atomic beam whose cross-section is rectangular is irradiatedonto the diamond-like-carbon thin film since the atomic beam maintainsthe same shape as the second ion beam. Therefore, the atomic beam isscanned on the diamond-like-carbon thin film in order to be irradiatedto the entire diamond-like-carbon thin film 130 (step S220).

[0130] In order to scan the atomic beam on the diamond-like-carbon thinfilm 130, the atomic beam may move while the position of thediamond-like-carbon thin film is unchanged, or the diamond-like-carbonthin film may be moved while the beam source position of the atomic beamis unchanged.

[0131] In the exemplary embodiments of the present invention, the atomicbeam moves while the position of the diamond-like-carbon thin film isunchanged.

[0132]FIG. 10 is a schematic view showing a non-contact alignment deviceaccording to the first exemplary embodiment, and FIG. 11 is a schematicview showing a first ion beam generating module, a second ion beamgenerating module and an atomic beam generating module of FIG. 10.

[0133] Referring to FIG. 10, a non-contact alignment apparatus foraligning liquid crystal molecules includes a first ion beam generatingmodule 150, a second beam generating module 160, an atomic beamgenerating module 170 and a transfer module 180.

[0134] Referring to FIG. 11, the first ion beam generating module 150includes a first ion beam housing 152, a source gas supplying unit 154,a source gas dissociation unit 156 and an ion acceleration unit 158.

[0135] The first ion beam housing 152 provides a space in which a firstion beam is generated. The space is isolated from outside. The first ionbeam housing 152 includes an ion generation region and an ionacceleration region.

[0136] The ion generating region of the first ion beam housing 152 isconnected with the source gas supplying unit 154. The source gassupplying unit 154 provides the first ion beam housing 152 with argon(Ar) gas via a pipe 155. The argon has a heavy atomic weight. Therefore,the argon easily breaks the carbon-carbon double bond when the argon isaccelerated.

[0137] The source gas dissociation unit 156 dissociates the argon gassupplied from the source gas supplying unit 154. The source gasdissociation unit 156 may have various elements.

[0138] For example, the source gas dissociation unit 156 may include acathode electrode, an anode electrode and a power supply for applyingpower to the cathode electrode and the anode electrode.

[0139] The power supply applies a predetermined voltage to the cathodeelectrode and the anode electrode so that the argon gas is dissociatedto argon ions and electrons.

[0140] The source gas dissociation unit 156 may include a tungsten (W)filament 156 a that emits electrons, a power supply 156 b for heatingthe tungsten filament 156 a.

[0141] The tungsten filament 156 a emits electrons when the tungstenfilament 156 a is heated at a temperature higher than about 2500K. Theelectrons emitted from the tungsten filament 156 a collide with theargon atom, so that the argon atom is transformed into argon ion. Theion acceleration unit 158 is installed in the ion acceleration region ofthe first ion beam housing 152. The ion acceleration unit 158accelerates the argon ions to have enough speed for the argon ions tobreak the carbon-carbon double bond of the diamond-like-carbon thinfilm.

[0142] The ion acceleration unit 158 includes an ion accelerationelectrode 158 a having a mesh structure, and a first power supply 158 bfor applying voltage having a polarity that is opposite to that of theions so as to the ion acceleration electrode 158 a. For example, whenthe ions having a positive polarity is generated in the first ion beamhousing 152 by the source gas dissociation unit 156, the first powersupply 158 b applies negative voltage to the ion acceleration electrode158 a. Then, coulomb force accelerates the ions having positive polaritytoward the ion acceleration electrode 158 a.

[0143] The speed of the ions is adjusted in accordance with magnitude ofthe voltage applied to the ion acceleration electrode 158 a.

[0144] When the voltage is too high, the ions has enough energy so thatthe atomic beam penetrate the surface of the diamond-like-carbon thinfilm and to be implanted into the diamond-like-carbon thin film. Whenthe voltage is too low, the ions may not have enough energy so that theatomic beam does not break the carbon-carbon double bond of thediamond-like-carbon thin film. Therefore, the voltage has a proper levelsuch that the atomic beam is not implanted into the diamond-like-carbonthin film and does not break the carbon-carbon double bond of thediamond-like-carbon thin.

[0145] As described above, the first ion beam that is generated from thefirst ion beam generating module 150 is accelerated by the ionacceleration electrode 158 a, and advances toward the second ion beamgenerating module 160.

[0146] The second ion beam generating module 160 includes a second ionbeam housing 162, a second ion beam generating body 164, a first ionbeam acceleration device 166 and a second power supply 168.

[0147] The second housing 162 includes non-conducting material to beelectrically insulated from the first ion beam housing 152. The secondion beam generating body 164 is installed on the second ion beam housing162. The second ion beam generating body 164 includes a first ion beaminlet 164 a through which the first ion beam enters and an second ionbeam outlet 164 b through which the second ion beam exits.

[0148] The first ion beam inlet 164 a is large so that the first ionbeam easily enters the second ion beam generating module 160. The firstion beam inlet 164 may have various shapes. The first ion beamacceleration device 166 is installed at the first ion beam inlet 164 a.The first ion beam acceleration device 166 includes conductive material.The second power supply 168 provides the first ion beam accelerationdevice 166 with a power voltage opposite to the polarity of the firstion beam. The first ion beam acceleration device 166 disposed at thefirst ion beam inlet 164 a accelerates the first ion beam again.

[0149] The second ion beam outlet 164 b has a rectangular shape. A widthof the second ion beam outlet 164 b is narrow, and a length of thesecond ion beam outlet 164 b is long. The first ion beam enters thefirst ion beam inlet 164 a and arrives at the second ion beam outlet 164b. The cross-section of the first ion beam has a rectangular figure whenthe first ion beam passes through the second ion beam outlet 164 b. Thesecond ion beam exits from the second ion beam outlet 164 b.

[0150] An atomic beam generating module 170 is installed in an atomicbeam generating region. In detail, the atomic beam generating module 170is installed adjacent to the second ion beam housing 162. The atomicbeam generating module 170 includes an electron generating unit 172 andan electron accelerating unit 174. The electron generating unit 172generates electrons. The electron accelerating unit 174 moves theelectron.

[0151] The electron generating unit 172 includes a tungsten filament 172a and a third power supply 172 b. The third power supply 172 b providesthe tungsten filament 172 a with power voltage such that the tungstenfilament 172 a is heated and has temperature higher than about 2500 K,and electrons are emitted from the tungsten filament 172 a.

[0152] The electron accelerating unit 174 faces the electron generatingunit 172. The electron accelerating unit 174 attracts the electronsgenerated from the electron generating unit 172 by coulomb force.

[0153] The electron accelerating unit 174 includes a fourth power supply174 a and an electrode 174 b. The fourth power supply 174 a appliespositive (+) voltage opposite to the polarity of the electron to theelectrode 174 b.

[0154] The electron generated from the electron generating unit 172moves toward the electron accelerating unit 174. A path of the electronintersects a path of the second ion beam. The ions of the second ionbeam combines with the electrons generated from the electron generatingunit 172. Therefore, the argon ion is transformed into argon atom (Ar)such that an argon atomic beam is generated. The argon ions of thesecond ion beam has substantially the same speed as that of the argonatoms of the argon atomic beam, and the second ion beam moves in thesame direction as in the argon atomic beam. Hereinafter, the source gasthat moves in the same speed and direction as those of the second ionbeam is referred to as an atomic beam.

[0155] The atomic beam generated from the atomic beam generating module170 has a rectangular cross-section and is irradiated onto a portion ofthe diamond-like-carbon thin film. In order that the atomic beam isirradiated onto the entire diamond-like-carbon thin film, the atomicbeam moves while the diamond-like-carbon thin film is fixed, or thediamond-like-carbon thin film is transferred while the atomic beam isfixed.

[0156] The transfer module 180 moves relatively with respect to acombined body including the first ion beam generating module 150, thesecond ion beam generating module 160 and the atomic beam generatingmodule 170.

[0157] In the non-contacting alignment device 140 described above, whichaligns the liquid crystal molecules by non-contact alignment method, theatomic beam forms an angle in the range from about 0° to about 90° withrespect to the diamond-like-carbon thin film.

[0158] When the liquid crystal is twist nematic liquid crystal, theatomic beam forms an angle in the range from about 0° to about 45°.

[0159] When the liquid crystal is vertically aligned in the verticalalignment mode, the atomic beam forms an angle in the range from about45° to about 90°, preferably, in the range from about 80° to about 90°.

[0160] The non-contact alignment device 140 may have at least two secondion beam outlets 164 b so as to provide at least two atomic beams. Thenon-contacting alignment device 140 may generate a plurality of atomicbeams, each of which advances toward the diamond-like-carbon thin filmand is incident onto the diamond-like-carbon thin film to form differentangles with respect to the diamond-like-carbon thin film. Therefore, theangle between the atomic beam and the diamond-like-carbon thin film maybe changed.

[0161] As shown in FIG. 12, a device for forming the diamond-like-carbonthin film forms the diamond-like-carbon thin film on a mother substrate,and the mother substrate is transferred to the device for forming thediamond-like-carbon thin film, and the liquid crystal molecules arealigned by the non-contact alignment device 140. Namely, thediamond-like-carbon thin film and the liquid crystal molecules may beprocessed by an in-situ process. FIG. 12 is a schematic view showing anon-contact alignment device and a device for forming adiamond-like-carbon thin film.

[0162] The device 190 for forming the diamond-like-carbon thin filmincludes a chamber 191, a substrate supporting unit 192 for supporting afirst mother substrate 10 or a second mother substrate 80, a reactiongas supplying module 193, a vacuum pump 194 and a plasma generator.

[0163] The substrate supporting unit 192 is disposed in the chamber 191.The first mother substrate 10 having the thin film transistor unit cell30 of FIG. 2 is transferred and disposed on the substrate supportingunit 192. The second mother substrate 80 having the color filter unitcell 100 of FIG. 5 is transferred and disposed on the substratesupporting unit 192.

[0164] The reaction gas supplying module 193 may provide the chamber 191with Helium (He), Hydrogen (H₂), Methane (CH₄) or Acetylene (C₂H₂).

[0165] The vacuum pump 194 provides the chamber 191 with a high-vacuumof about 60 Torr. Therefore, impurities or gas except for reaction gasmay not be participated in a process of forming diamond-like-carbon thinfilm.

[0166] The plasma generator forms diamond-like-carbon thin film withreaction gas. The plasma generator includes a cathode electrode 195, ananode electrode 196 and a power supply 197. The high voltage is appliedbetween the cathode electrode 195 and the anode electrode 196, so thatthe Helium or the Argon gas is ionized.

[0167] The device 190 for forming diamond-like-carbon thin film may becombined directly with the alignment device 140.

[0168] In contrast, a load lock chamber 200 may installed between thedevice 190 and the alignment device 140. The first mother substrate 10or the second mother substrate 80 stands by temporarily in the load lockchamber 200.

[0169] When the device 190 for forming the diamond-like-carbon thinfilm, the load lock chamber 200 and the alignment device 140 areinstalled so that the diamond-like-carbon thin film and the liquidcrystal molecules may be processed by a in-situ process, the time foraligning liquid crystal molecules is reduced. Further, contamination ofthe first mother substrate 10 and the second mother substrate 80 isreduced.

[0170] <Second Embodiment of Non-Contact Type Alignment of LiquidCrystal Molecules>

[0171]FIG. 13 is a flow chart showing a method of aligning liquidcrystal by a non-contact method according to a second exemplaryembodiment.

[0172] In previous procedure, the diamond-like-carbon thin film havingcarbon-carbon double bond is formed on the first substrate 10 having thethin film transistor unit cell 30 of FIG. 2 or on the second substrate80 having the color filter unit cell 100 of FIG. 5. Thediamond-like-carbon thin film is formed via chemical vapor deposition(CVD).

[0173] Referring to FIG. 13, the atomic beam collides with thediamond-like-carbon thin film, so that a polarized functional group foraligning liquid crystal molecules is generated (step S225).

[0174]FIG. 14 is a flow chart showing a method of generating a polarizedfunctional group in the diamond-like-carbon thin film according to thesecond exemplary embodiment.

[0175] Referring to FIG. 14, a first ion beam is generated andaccelerated toward the diamond-like-carbon thin film (step S226).

[0176] Then, the first ion beam is transformed into a second ion beam ofwhich cross-section is square shaped (step S227). A speed of the secondion beam is similar to a speed of the first ion beam. The second ionbeam forms an angle in the range from about 0° to about 90° with respectto the diamond-like-carbon thin film.

[0177] When the second ion beam advances toward the diamond-like-carbonthin film, the second ion beam collides with electrons that intersectthe second ion beam, so that the second ion beam is transformed into theatomic beam (step S228). The speed and direction of the second ion issubstantially preserved, because the mass of the ion is much larger thanthat of the electron. Therefore, the speed and the direction of theatomic beam are substantially equal to the speed and the direction ofthe second ion beam.

[0178] The atomic beam arrives at a surface of the diamond-like-carbonthin film and collides with the diamond-like-carbon thin film. Theatomic beam scans the surface of the diamond-like-carbon thin film (stepS229).

[0179] The atomic beam that collides with the diamond-like-carbon thinfilm changes the surface of the diamond-like-carbon thin film. Indetail, the atomic beam breaks the carbon-carbon double bond to generatesub-chain that has a carbon-carbon single bond structure and radicalstate. Namely, the radical formed in diamond-like-carbon thin film formspolarized functional group for aligning liquid crystal molecules.

[0180] The polarized functional group is very unstable. Therefore, thepolarized functional group tends to regenerate the carbon-carbon doublebond structure.

[0181] When the stable carbon-carbon singlebond structure is restored tothe unstable carbon-carbon double bond structure, the polarizedfunctional group generated in the diamond-like-carbon thin filmdisappears.

[0182] When the polarized functional group for aligning liquid crystalmolecule is not shown, the liquid crystal molecules may not maintain thepre-tilt angle, so that display quality of the liquid crystal displaydevice is deteriorated.

[0183] Therefore, in order to maintain the display quality of the liquidcrystal display device, the polarized functional group for aligningliquid crystal molecule should remain permanently on thediamond-like-carbon thin film.

[0184] Therefore, after the polarized functional group is generated, thepolarization preserving substance is combined with the polarizedfunctional group such that the polarized functional group existspermanently on the diamond-like-carbon thin film (step S230).

[0185] When the carbon-carbon double bond is broken, carbon-carbonsingle bond and sub-chain are generated. In order that the polarizedfunctional group exists permanently, the sub-chain is combined withother functional group.

[0186]FIG. 15 is a flow chart showing a process of introducing ahydroxyl radical (OH⁻) into the polarized functional group.

[0187] In order that the polarized functional group exists permanently,a sub-chain of the polarized functional group combines with hydroxylradical (—OH), so that a C—OH bond is formed in the diamond-like-carbonthin film.

[0188] Firstly, deionized water (DI water) is heated into a vapor (stepS231). The vapor is applied onto the surface of the diamond-like-carbonthin film (step S232).

[0189] Heating the deionized water to form the vapor is not essentialbut the deionized water that is vaporized activates the combination ofthe deionized water and the sub-chain.

[0190] When the hydroxyl radical (—OH) is combined with the sub-chain ofthe diamond-like-carbon thin film, the sub-chain may not be recombinedwith carbon. Therefore, the carbon atoms on the diamond-like-carbon thinfilm have carbon-carbon single bonds, so that the polarized functionalgroup that is electrically unstable is maintained.

[0191] According to an embodiment described above, the polarizedfunctional group that is combined with the hydroxyl radical (—OH)prevents the diamond-like-carbon thin film from being electricallyneutralized.

[0192] <Third Embodiment of Non-Contact Type Alignment of Liquid CrystalMolecules>

[0193]FIG. 16 is a flow chart showing a process of introducing ahydrogen ion into the polarized functional group according to a thirdexemplary embodiment of the present invention.

[0194] Deionized water is supplied to the surface of thediamond-like-carbon thin film in order that hydrogen ion (H⁺) iscombined with the sub-chain (step S233).

[0195] Then, ultra-violet ray is irradiated onto the surface of thediamond-like-carbon thin film in order that the hydrogen ion (H⁺) iscombined with the sub-chain (step S234).

[0196] When the ultra-violet ray is irradiated on the deionized water,two hydrogen ions and one oxygen ion are generated as shown in thefollowing chemical formula.

[0197] <Chemical Formula 1>

H2O→2H⁺+O⁻²

[0198] The hydrogen ion (H⁺) dissociated by the ultra-violet ray iscombined with the sub-chain to form a C—H bond.

[0199] When the hydrogen ion (H⁺) is combined with the sub-chain formedin the diamond-like-carbon thin film in which the polarized functionalgroup is formed, the sub-chain may not be recombined with a carbon atom.Therefore, the electrically unstable polarized functional group that iselectrically unstable remains in the diamond-like-carbon thin film.

[0200] Bonding the hydrogen ion (H⁺) with the sub-chain by theultra-violet ray and the deionized water may be carried out at a lowtemperature.

[0201] In contrast, when the hydrogen gas passes through a region havingtemperature higher than 2500K, protons (H⁺) and electrons (e⁻) aredissociated from the hydrogen gas. The protons (H⁺) may be combined withthe sub-chain to form the C—H bond.

[0202] <Fourth Embodiment of Non-Contact Type Alignment of LiquidCrystal Molecules>

[0203]FIG. 17 is a flow chart showing a process of introducing anitrogen ion into the polarized functional group according to a fourthexemplary embodiment of the present invention.

[0204] Nitrogen ion (N⁻) is combined with the sub-chain formed in thediamond-like-carbon thin film by the atomic beam in order that thepolarized functional group may remain on the diamond-like-carbon thinfilm.

[0205] Nitrogen gas (N₂) is provided (step S235) and the nitrogen gas isdissociated to form the nitrogen ion (N⁻) (step S236). A voltage higherthan the ionization voltage of the nitrogen is applied to the nitrogengas (N₂), so that the nitrogen ion (N⁻) is formed.

[0206] The nitrogen ion (N⁻) is combined with the polarized functionalgroup formed in the diamond-like-carbon thin film to form a C—N bond(step S237).

[0207] When the nitrogen ion (N⁻) is combined with the sub-chain, thesub-chain may not be recombined with a carbon atom, and the carbon atomsmaintain a carbon-carbon single bond. Therefore, the polarizedfunctional group that is electrically unstable is maintained.

[0208] In above described first embodiment to third embodiment, thehydroxyl radical, the hydrogen ion or the nitrogen ion is combined withthe polarized functional group so as to maintain the polarizedfunctional group.

[0209] Hereinafter, a device for non-contact alignment of liquid crystalaccording to the second exemplary embodiment of non-contact aligning ofliquid crystal molecule is shown.

[0210] <Fifth Embodiment of Non-Contact Type Alignment of Liquid CrystalMolecules>

[0211]FIG. 18 is a schematic view showing a non-contact alignment deviceaccording to a fifth exemplary embodiment of the present invention.

[0212] Referring to FIG. 18, a non-contact alignment device 210 fornon-contacting aligning liquid crystal molecule includes an atomic beamirradiating part 220 and polarity maintaining part 240.

[0213] Further, the non-contact alignment device 210 may includes a thinfilm forming part 230 for forming a diamond-like-carbon thin film on thefirst mother substrate 10 or on the second mother substrate 80.

[0214] Referring to FIG. 18, the thin film forming part 230 includes achamber 231, a substrate supporting unit 232, a reaction gas supplyingmodule 233, a vacuum pump 234 and a plasma generator having a cathodeelectrode 235, an anode electrode 236 and a power supply 237.

[0215] The substrate supporting unit 232 is disposed in the chamber 231.The first mother substrate 10 on which thin film transistor unit cellsare formed, and the second mother substrate 80 on which color filterunit cells are formed are supported by the substrate supporting unit232.

[0216] The reaction gas supplying module 233 supplies the chamber 231with reaction gas such as helium (He), argon (Ar), Hydrogen (H₂),methane (CH₄) or acetylene (C₂H₂).

[0217] The vacuum pump 234 generates a high vacuum that is about 60 Torrin the chamber 231, such that the other gas except for the reaction gasmay not participate in the process for forming the diamond-like-carbonthin film.

[0218] The diamond-like-carbon thin film is formed with the reaction gasby the plasma generator.

[0219] The plasma generator includes the cathode electrode 235, theanode electrode 236 and the power supply 237. A sufficient voltage isapplied between the cathode electrode 235 and the anode electrode 236,such that the helium (He) or argon (Ar) may be ionized.

[0220] The thin film forming part 230 may be directly combined with theatomic beam irradiating part 220.

[0221] However, a load lock chamber 289 may be interposed between thethin film forming part 230 and the atomic beam irradiating part 220. Thefirst mother substrate 10 or the second mother substrate 80 stand by inthe load lock chamber 289 as shown in FIG. 18.

[0222] When the thin film forming part 230, the load lock chamber 289,the atomic beam irradiating part 220 and the polarity maintaining part240 are combined in series, a procedure for aligning a liquid crystalmolecule needs reduced time and contamination of the first mothersubstrate 10 and the second mother substrate 80 is reduced.

[0223] The first mother substrate 10 or the second mother substrate 80on which the diamond-like-carbon thin film is formed is transferred tothe atomic beam irradiating part 220.

[0224] Atomic beam generated from the atomic beam irradiating part 220collides with the diamond-like-carbon thin film formed on the firstmother substrate 10 or the second mother substrate 80, and acarbon-carbon double bond is broken, so that a carbon-carbon single bondand sub-chain are formed in the diamond-like-carbon thin film.Therefore, the polarized functional group for aligning liquid crystalmolecule is formed.

[0225] The polarity maintaining part 240 maintains the polarizedfunctional group, such that the polarized functional group remains inthe diamond-like-carbon thin film.

[0226] Hereinafter, various polarity maintaining parts 240 aredisclosed.

[0227] Referring to FIG. 18, the polarity maintaining part 240 includesa chamber 241, a water supplying module 242 and a spraying module 243.

[0228] A process for maintaining polarized functional group is performedin the chamber 241.

[0229] The supplying module 243 supplies the chamber 241 with deionizedwater. The supplying module 243 may further includes a heating unit 244for heating the deionized water to be transformed into vapor.

[0230] The spraying module 243 sprays the deionized water or the vaporonto the first mother substrate 10 or on the second mother substrate 80uniformly. The spraying module 243 includes a spaying nozzle 243 a.

[0231] <Sixth Embodiment of Non-Contact Type Alignment of Liquid CrystalMolecules>

[0232]FIG. 19 is a schematic view showing a non-contact alignment deviceaccording to a sixth exemplary embodiment of the present invention.

[0233] Referring to FIG. 19, the polarity maintaining part 250 includesa water supplying part 260 and a ultra-violet irradiating part 270.

[0234] The water supplying part 260 includes a chamber 261, a watersupplying module 262 and a spraying module 263.

[0235] Water is sprayed on the diamond-like-carbon thin film in thechamber 261. The water supplying module 262 supplies the chamber 261with the water. The spraying module 263 sprays the water or vapor on thefirst mother substrate 10 or on the second mother substrate 80uniformly. The spaying module 263 includes a spraying nozzle 263 a.

[0236] The ultra-violet irradiating part 270 includes a chamber 271 anda ultra-violet irradiating module 272. The ultra-violet irradiatingmodule 272 irradiates ultra-violet beam onto the diamond-like-carbonthin film. The ultra-violet beam dissociates the water into hydrogen ion(H⁺) and oxygen ion (O²⁻). The hydrogen ion (H⁺) is combined with thesub-chain formed in the diamond-like-carbon thin film.

[0237] The sub-chain is combined with the hydrogen ion (H⁺). Therefore,the sub-chain may not recombine with carbon atom. Therefore, thepolarized functional group is maintained.

[0238] The dissociation of the water into hydrogen ion (H⁺) and oxygenion (O²⁻) may be performed at the room temperature.

[0239] A thin film forming part 230 and an atomic beam irradiating part220 are the same as those disclosed in FIG. 18. Therefore, thedescription of the identical elements is omitted.

[0240] <Seventh Embodiment of Non-Contact Type Alignment of LiquidCrystal Molecules>

[0241]FIG. 20 is a schematic view showing a non-contact alignment deviceaccording to seventh exemplary embodiment of the present invention.

[0242] Referring to FIG. 20, a polarity maintaining part 280 includes achamber 281, a hydrogen supplying module 283, a hydrogen dissociationmodule 285.

[0243] A vacuum pump 284 maintains the low-pressure of about 60 Torr inthe chamber 281, so that the other gases except for reaction gas may notparticipate in the process for forming the diamond-like-carbon thinfilm.

[0244] In particular, material for maintaining polarized functionalgroup is unstable material such as hydrogen, the pressure of the chamber281 is maintained at a low pressure.

[0245] The hydrogen supplying module 283 supplies the chamber 281 with apredetermined amount of hydrogen gas.

[0246] The hydrogen dissociation module 285 transforms the hydrogen gasinto hydrogen ion.

[0247] The hydrogen dissociation module 285 includes a heater 287 and apower supply 286. The heater 287 heats the hydrogen gas, such that atemperature of the hydrogen gas is higher than about 2500K. The powersupply 286 supplies the heater 287 with power.

[0248] The heater 287 includes tungsten (W), and the heater 287 has amesh-shape.

[0249] When the hydrogen gas is heated, such that the temperature of thehydrogen gas is higher than about 2500K, the hydrogen gas is dissociatedinto hydrogen ions and electrons.

[0250] The hydrogen ions are combined with sub-chain formed in thediamond-like-carbon thin film, so that C—H bond is formed.

[0251] When the hydrogen ions are combined with the sub-chain, thesub-chain may not be recombined with carbon atoms, so that the polarizedfunctional group is maintained.

[0252] A thin film forming part 230 and an atomic beam irradiating part220 are identical element disclosed in FIG. 18. Therefore, thedescription of the identical elements is omitted.

[0253] <Eighth Embodiment of Non-Contact Type Alignment of LiquidCrystal Molecules>

[0254]FIG. 21 is a schematic view showing a non-contact alignment deviceaccording to a eighth exemplary embodiment of the present invention.

[0255] Referring to FIG. 21, a polarity maintaining part 290 includes achamber 291, a nitrogen supplying module 293, a nitrogen dissociationmodule 295.

[0256] Vacuum pump 294 maintains a low-pressure in the chamber 281, sothat the other gases except for reaction gas may not participate in theprocess for forming the diamond-like-carbon thin film.

[0257] The nitrogen supplying module 293 supplies the chamber 291 with apredetermined amount of nitrogen gas.

[0258] The nitrogen dissociation module 295 transforms the nitrogen gasinto nitrogen ion.

[0259] The nitrogen dissociation module 295 includes a heater 297 and apower supply 296. The heater 297 heats the nitrogen gas, such that atemperature of the nitrogen gas is higher than about 2500K. The powersupply 296 supplies the heater 297 with power.

[0260] The heater 297 includes tungsten (W), and the heater 297 has amesh-shape.

[0261] When the nitrogen gas is heated, such that the temperature of thenitrogen gas is higher than about 2500K, the nitrogen gas is dissociatedinto nitrogen ions and electrons.

[0262] The nitrogen ions are combined with sub-chain formed in thediamond-like-carbon thin film, so that C—N bond is formed.

[0263] When the nitrogen ions are combined with the sub-chain, thesub-chain may not be recombined with carbon atoms, so that the polarizedfunctional group is maintained. A thin film forming part 230 and anatomic beam irradiating part 220 are identical element disclosed in FIG.18. Therefore, the description of the identical elements is omitted.

[0264] In the above-described <First embodiment of non-contact typealignment of liquid crystal molecules> to <Eighth embodiment ofnon-contact type alignment of liquid crystal molecules>, the atomic beamforms the polarized functional group in the diamond-like-carbon thinfilm, for aligning liquid crystal molecule.

[0265] A direction of the atomic beam and a cross-sectional shape of theatomic beam are important, because the direction and the cross-sectionalshape influence a pre-tilt angle of the liquid crystal molecule.

[0266] <Ninth Embodiment of Non-Contact Type Alignment of Liquid CrystalMolecules>

[0267]FIG. 22 is a flow chart showing a method for generating an atomicbeam according to a ninth exemplary embodiment of the present invention.

[0268] Referring to FIG. 22, firstly ion is formed (step S235). A sourcegas is dissociated to form the ion. Argon (Ar) gas may be used for thesource gas. The argon gas is one of the inert gases that have lowchemical activity and that may not be included in any chemical compound,and the argon gas is heavy, so that the argon gas may apply a largeimpact on the carbon-carbon double bond and break the carbon-carbondouble bond.

[0269] In order to obtain the ion from the source gas, two methods areused.

[0270] Firstly, when voltage is applied to the source gas, the sourcegas is dissociated into ions, electrons and neutron. Secondly, when thesource gas is heated, such that the temperature of the source gas ishigher than 2500K, the source gas is dissociated, and ions are formed.

[0271] When the ions are formed, the ions are accelerated to form afirst ion beam (step S240). A first electrode has opposite polarity tothe polarity of the ions, and the first electrode attracts the ions, sothat the ions are accelerated.

[0272] Then the ion beam is transformed into a second ion beam of whichcross-section has rectangular or circular shape (step S245).

[0273] The shape of the cross-section of the second ion beam influencesthe alignment quality of liquid crystal molecules.

[0274] The cross-section of the second ion beam may have a rectangularshape. A width of the rectangular second ion beam determines an intervalof the aligned liquid crystal molecules. The smaller the width is, thesmaller is the interval.

[0275] The first ion beam is focused to form the second ion beam. Thefirst ion beam is a flow of ions, not a flow of photons. Light, as aflow of the photons, may be focused by lens, but the first ion beam maynot be focused by lens because the progress of the first ion beam may beinterrupted by the lens. A housing focuses the first ion beam. An areaof an inlet of the housing is large, but an area of an outlet of thehousing is small and rectangular shaped. Therefore, when the ion beampasses through the housing, the first ion beam is focused. A secondelectrode that has polarity opposite to the polarity of the first ionbeam is formed adjacent to the outlet, so that the first ion beam isaccelerated.

[0276] After the second ion beam is formed, electrons are combined withthe second ion beam so that the atomic beam is formed (step S250).Electrons intersect the second ion beam, such that electrons arecombined with the second ion beam.

[0277] The atomic beam may be used in various fields. For example,atomic beam that is electrically neutral is injected into a thin film tochange characteristics of the thin film, or the atomic beam is used formaintaining a pre-tilt angle of the liquid crystal molecule.

[0278] <Tenth Embodiment of Non-Contact Type Alignment of Liquid CrystalMolecules>

[0279]FIG. 23 is a schematic view showing an atomic beam generatingdevice according to a tenth exemplary embodiment of the presentinvention.

[0280] Referring to FIG. 23, an atomic beam generating device 300includes an ion generating part 310, a first ion beam generating part320, a second ion beam generating part 330 and an atomic beam generatingpart 340.

[0281] The ion generating part 310 includes a chamber 312, a source gassupplying unit 314 and a source gas dissociation unit 316.

[0282] The chamber 313 provides a space in which ions are formed. Thechamber 312 has opening 312, so that the ions advance through theopening 313.

[0283] The opening 313 may have a circular shape or a rectangular shapethat has width and length. The length is larger than the width.

[0284] The source gas supplying unit 314 and the source gas dissociationunit 316 are formed in the chamber 312.

[0285] The source gas supplying unit 314 supplies the chamber 312 withargon (Ar) gas. The argon gas is one of the inert gases that have lowchemical activity and that may not be included in any chemical compound,and the argon gas is heavy, so that it is proper to impact on thecarbon-carbon double bond formed between two carbon atoms and to breakthe carbon-carbon double bond.

[0286] The source gas dissociation unit 316 dissociates the argon gas.

[0287] The source gas dissociation unit 316 may include a cathodeelectrode, an anode electrode and a power supply 318.

[0288] The source gas dissociation unit 316 may include a tungstenfilament 317 for heating the source gas such as argon gas, and a powersupply for supplying the tungsten filament 317 with power voltage. Thesource gas dissociation unit 316 heats the source gas, such thattemperature of the argon gas becomes higher than about 2500K. When thesource gas is heated, so that the temperature of the source gas becomeshigher than about 2500K, the source gas is dissociated into ions.

[0289] The first ion beam generating part 320 accelerates the ions. Thefirst ion beam generating part 320 includes a first electrode 322 and afirst power supply 324 for supplying the first electrode 322 with power.

[0290] The first electrode 322 has a mash-shape. The first electrode 322attracts the ions, so that the ions are accelerated and pass through thefirst electrode 322.

[0291] The first power supply 324 applies voltage that has polarityopposite to the ion to the first electrode 322.

[0292] The absolute value of the voltage determines the magnitude ofacceleration. When the absolute value becomes larger, the magnitude ofacceleration becomes larger. The larger the absolute value of thevoltage is, the larger is the magnitude of acceleration.

[0293] The second ion beam generating part 330 modulates a shape of thefirst ion beam. In detail, the second ion beam generating part 330reduces cross-sectional area of the first ion beam, while not reducingthe amount of the first ion beam. Therefore, the second ion beamgenerating part 330 focuses the first ion beam.

[0294] The second ion beam generating part 330 includes a second ionbeam housing 332, a second electrode 334 and a second power supply 336.

[0295] The second ion beam housing 332 has a hollow prism shape that hasthree faces. The second ion beam housing 332 has a hollow. A first ionbeam inlet 333 a is formed on a face of the second ion beam housing 332that faces the first ion beam generating part 320. A second ion beamoutlet 333 b is formed on an edge of the second ion beam housing 332that faces the first ion beam inlet 333 a. The first ion beam is focusedby the second ion beam outlet 333 b and exits though the second ion beamoutlet 333 b to form a second ion beam.

[0296] The second electrode 334 is installed in the first ion beam inlet333 a of the second ion beam housing 332. The second electrode 334 has amesh-shape and includes conductive material.

[0297] The second power supply 336 provides the second electrode 334with voltage, which has polarity opposite to the polarity of the firstion beam, so that the first ion beam is accelerated once more.

[0298] The atomic beam generating part 340 includes an electrongenerating unit 342 and an electron accelerating unit 346.

[0299] The electron generating unit 342 includes a tungsten filament 343and power supply 344 for applying power voltage to the tungsten filament343. The tungsten filament 343 is heated by the power supply 344. When atemperature of the tungsten filament 343 is above about 2500K, electronsare emitted from the tungsten filament 343.

[0300] The electron accelerating unit 346 includes an electronacceleration electrode 347 and power supply 348 for supplying theelectron accelerating unit 346 with power voltage. The electronaccelerating unit 346 faces the tungsten filament 343 and attracts theelectrons generated from the tungsten filament 343 so that electron beamis formed.

[0301] The electron generating unit 342 and the electron acceleratingunit 346 are disposed, such that a virtual line connecting the electrongenerating unit 342 with the electron accelerating unit 346 intersectsthe direction of advancing of the second electron beam. Therefore,electron beam generated from the electron generating unit 342 andaccelerated by the electron accelerating unit 346 intersects the secondion beam. The electrons of the electron beam are combined with thesecond ion beam, so that the second ion beam is transformed into theatomic beam that has substantially the same speed and direction as thoseof the second ion beam.

[0302] A sequence of the first ion beam generating part and the secondion beam generating part 330 may be changed. Only the second ion beamgenerating part 330 may be disposed between the ion generating part 310and the atomic beam generating part 340. The second ion beam generatingpart 330 may have various shapes. The first ion beam inlet 333 a mayhave a circular shape, and the second ion beam outlet 333 b may have arectangular shape.

[0303] <Eleventh Embodiment of Non-Contact Type Alignment of LiquidCrystal Molecules>

[0304]FIG. 24 is a flow chart showing a non-contact aligning method ofaligning liquid crystal molecule on an alignment film according toeleventh embodiment of the present invention, FIG. 26 is across-sectional view showing a transparent thin film formed on a mothersubstrate, and FIG. 27 is a cross-sectional view showing a carbonpolymer formed on the transparent thin film of FIG. 26.

[0305] Referring to FIGS. 24, 26 and 27, a transparent thin film 365 isformed on the thin film transistor unit cell 30 of the first mothersubstrate 10 so as to align liquid crystal molecule on the first mothersubstrate 10. The transparent thin film 365 is formed also the colorfilter unit cell 100 of the second mother substrate 80 so as to alignliquid crystal molecule on the second mother substrate 80 (step S255).

[0306] Firstly, the first mother substrate 10 or the second mothersubstrate 80 are loaded in vacuum space that is sealed in order to formthe transparent thin film. Amorphous silicon thin film may be used asthe transparent thin film.

[0307] In order to form the transparent thin film on the first mothersubstrate 10 or on the second mother substrate 80 in the sealed vacuumspace, silane gas (SiH₄) and hydrogen gas is provided in the space.Then, the silane gas and the hydrogen gas are reacted with each other toform amorphous silicon. The amorphous silicon is deposited on the thinfilm transistor unit cell 30 of the first mother substrate 10 or on thecolor filter unit cell 100 of the second mother substrate 80, so thatthe transparent amorphous silicon thin film is formed.

[0308] When the transparent thin film is formed on the first mothersubstrate 10 or on the second mother substrate 80, alignment grooves foraligning liquid crystal molecule are formed on the first mothersubstrate 10 or on the second mother substrate 80 (step S260).

[0309] The alignment grooves are formed through to the process in whichpolymers are deposited on the first mother substrate 10 or on the secondmother substrate 80.

[0310] In order to deposit polymers on the first mother substrate 10 oron the second mother substrate 80, fluorocarbon (CF₄), trifluoromethane(CHF₃) and oxygen (O₂) are supplied to the sealed space that has a lowpressure. Then, the fluorocarbon (CF₄), trifluoromethane (CHF₃) andoxygen (O₂) form the carbon polymer via chemical vapor deposition (CVD).

[0311] The carbon polymer is deposited on the first mother substrate 10or on the second mother substrate 80, such as snow is deposited on aground. The carbon polymer is deposited in island shapes that are spacedapart with each other. That is, the carbon polymer is not deposited onthe whole surface of the first mother substrate 10 or on the secondmother substrate 80. The islands of carbon polymers are formed via asimilar process to the process in which seed for forming hemisphericalgrain (HSG) is scattered uniformly.

[0312] Preferably, the islands have enough intervals so that liquidcrystal molecule may be disposed between the islands, and the height ofthe islands is in the range from about 10 Å to about 100 Å. The carbonpolymer is grown directly upward from the first mother substrate 10 oron the second mother substrate 80.

[0313] <Twelfth Embodiment of Non-Contact Type Alignment of LiquidCrystal Molecules>

[0314]FIG. 25 is a schematic view showing a non-contact alignment deviceaccording to a twelfth exemplary embodiment of the present invention.FIG. 26 is a cross-sectional view showing a transparent thin film formedon a mother substrate. FIG. 27 is a cross-sectional view showing acarbon polymer formed on the transparent thin film of FIG. 26.

[0315] Referring to FIGS. 25 to 27, a non-contact alignment device 369includes a thin film forming part 360 and a groove forming part 350.

[0316] The thin film forming part 360 includes a thin film formingchamber 361, a reaction gas supplying module 362, a plasma generatorhaving a cathode electrode 364 and an anode electrode 366, and a vacuumpump 368.

[0317] The reaction gas supplying module 362 supplies the thin filmforming chamber 361 with silane gas (SiH₄) and hydrogen gas (H₂).

[0318] The plasma generator includes a cathode electrode 364 and ananode electrode 366. High voltage is applied between the cathodeelectrode 364 and the anode electrode 366, so that the silane gas (SiH₄)and the hydrogen gas (H₂) are reacted with each other.

[0319] Referring to FIG. 26, a transparent thin film 365, such asamorphous silicon thin film, is formed on a first mother substrate 10 oron a second mother substrate 80 with silane gas (SiH₄) and hydrogen gas(H₂).

[0320] Referring again to FIG. 25, the first mother substrate 10 or thesecond mother substrate 80 having the transparent thin film istransferred to a load lock chamber 363. The first mother substrate 10 orthe second mother substrate 80 stands by for the next procedure in theload lock chamber 363.

[0321] The groove forming part 350 includes a groove forming chamber351, a reaction gas supplying module 353, a reaction gas polymerizationunit having a cathode electrode 355 and an anode electrode 357.

[0322] The pressure in the groove forming chamber 351 is maintained at ahigh-vacuum. The first mother substrate 10 having the transparent thinfilm or the second mother substrate 80 having a transparent thin film istransferred to the groove forming chamber 351.

[0323] The transparent thin film includes amorphous silicon thin film.

[0324] The reaction gas supplying module 353 supplies the groove formingchamber 351 with reaction gas. The reaction gas forms carbon polymer onthe transparent thin film.

[0325] Referring to FIG. 27, carbon polymers 358 are formed on atransparent thin film 365. The carbon polymers 358 are formed to bespaced apart with each other like islands. A longitudinal direction ofthe carbon polymers 358 is substantially perpendicular to the surface ofthe transparent thin film 365. It is preferable that the height of thecarbon polymers 358 is in the range from about 10 Å to about 100 Å. Thereaction gas includes fluorocarbon (CF₄), trifluoromethane (CHF₃) andoxygen (O₂) for polymerize the fluorocarbon (CF₄) and trifluoromethane(CHF₃).

[0326] Referring again to FIG. 25, the reaction gas polymerization unit355 and 357 allows the reaction gas to react with each other so as toproduce the carbon polymer 358 of FIG. 27. The reaction gaspolymerization unit includes the cathode electrode 355, the anodeelectrode 357 and power supply (not shown). The cathode electrode 355and the anode electrode 357 transform the oxygen into plasma.

[0327] The power supply (not shown) provides the cathode electrode 355and the anode electrode 357 with enough voltage to transform the oxygeninto plasma state.

[0328] The groove forming part 350 forms the carbon polymer. The islandsof carbon polymers are formed via a similar process to the process inwhich seed for forming hemispherical grain (HSG) is scattered uniformly.

[0329] Referring again to FIG. 1, the island-shaped carbon polymer isreferred to as an alignment film. The alignment film is formed as abovedescribed method (step S200).

[0330] When the alignment film is formed of the thin film transistorunit cell 30 of the first mother substrate 10 and on the color filterunit cell 100 of the second mother substrate 80, the first mothersubstrate 10 and the second mother substrate 80 are assembled into anassembled substrate (step S300).

[0331] The first mother substrate 10 and the second mother substrate 80is erected to be disposed parallel to the gravitational force directionand loaded into an automatically guided vehicle (AGV) or manually guidedvehicle (MGV) and transferred to assembled substrate manufacturingdevice.

[0332] In order to form the assembled substrate, a fence is formed onone of the thin film transistor unit cell 30 and the color filter unitcell 100 (step S305). The number of the thin film transistor unit cell30 formed on the first mother substrate 10 is equal to the number of thecolor filter unit cell 100 formed on the second mother substrate 80.

[0333] The fence includes a curable material and an adhesive material.The curable material is cured, when an ultra-violet beam is irradiatedonto the curable material. The adhesive material combines the firstmother substrate 10 with second mother substrate 80. The fence hasband-shape that has narrow width, and the fence surrounds an edge of thethin film transistor unit cell 30 or an edge of the color filter unitcell 100 to form a closed loop.

[0334] Liquid crystal is dropped into an internal region defined by thefence so as to fill up the internal region defined by the fence (stepS310).

[0335] An amount of liquid crystal filled into the internal region iscalculated based on an area that is surrounded by the fence and cell gapthat is a distance between the thin film transistor unit cell 30 and thecolor filter unit cell 100 when the thin film transistor unit cell 30and the color filter unit cell 100 are assembled.

[0336] When the liquid crystal is dropped into the internal region, theliquid crystal is dropped on a plurality of regions that is disposed inthe internal region.

[0337] Then, the first mother substrate 10 and the second mothersubstrate 80 are assembled together in vacuum. The fence intermediatesbetween the first mother substrate 10 and the second mother substrate80. Hereinafter, the thin film transistor unit cell 30 of the firstmother substrate 10 and the color filter unit cell 100 of the secondmother substrate 80 are referred to as a liquid crystal display unitcell.

[0338] The first mother substrate 10 and the second mother substrate 80including the liquid crystal display unit cell are left underatmospheric pressure for one hour, so that the liquid crystal dropped ona plurality of regions is uniformly spread.

[0339] However, even when the first mother substrate 10 and the secondmother substrate 80 including the liquid crystal display unit cell areleft under atmospheric pressure for one hour, the liquid crystal of someof the liquid crystal display unit cell is not spread. When the liquidcrystal is not spread uniformly throughout the entire liquid crystaldisplay unit cell, an image is not displayed in a liquid crystalunfilled region of the liquid crystal display unit cell, where theliquid crystal does not exist.

[0340] Therefore, after the first mother substrate 10 and the secondmother substrate 80 including the liquid crystal display unit cell areleft under atmospheric pressure for one hour, a detecting process fordetecting the liquid crystal unfilled region is performed. The detectingprocess is not essential. The detecting process is performed only forreducing the product failure.

[0341]FIG. 28 is a flow chart showing a method for detecting unfilledregion in which the liquid crystal is not filled.

[0342] Referring to FIG. 28, a first light is generated (step S315) inorder to detect the liquid crystal unfilled region. The first lightarrives at a bottom face of the first mother substrate 10 and passesthough the first mother substrate 10, liquid crystal disposed on thefirst mother substrate. When the first light passes through the liquidcrystal, the first light is transformed into a second light that hasdifferent characteristics from that of the first light.

[0343] The second light passes through the second mother substrate 80and exits from an upper face of the second mother substrate 80.

[0344] The second light that exits from the second mother substrate 80is detected (step S320).

[0345] The detected second light generates an analog signal. The analogsignal is transformed into image data that is a digital signal. Theimage data is compared with reference data (step S325).

[0346] When the image data are different from the reference data, theliquid crystal unfilled region exists in the liquid crystal display unitcell. Therefore, the first mother substrate 10 and the second mothersubstrate 80 including the liquid crystal display unit cell are stood byat an atmospheric pressure for another two hours (step S335).

[0347] In order to spread the liquid crystal, an external force may beapplied to the liquid crystal display unit cell.

[0348] When the liquid crystal unfilled region is not detected, theultra-violet beam is irradiated onto the fence that combines the firstmother substrate 10 with the second mother substrate 80 so as to curethe fence.

[0349] Hereinafter, a detecting device for detecting the liquid crystalunfilled region is described in detail.

[0350]FIG. 29 is a schematic view showing an example of detecting devicefor detecting the unfilled region.

[0351] Referring to FIG. 29, a detecting device for detecting the liquidcrystal unfilled region includes a base body 371, a back light unit 373,an unfilled region detector 375 and a control unit 378.

[0352] The back light unit 373, the unfilled region detector 375 and thecontrol unit 378 are installed in the base body 371.

[0353] The back light unit 373 includes lamps 374 for generating firstlight 374 a, and the power supply 374 b for supplying the lamps withpower. A transferring unit 374 c is formed over the back light unit 373.The transferring unit 374 c loads/unloads the first mother substrate 10and the second mother substrate 80 assembled with each other into/fromthe base body 371. The transferring unit 374 c includes rollers 374 darranged along a line and a roller driving unit (not shown) for drivingthe rollers 374 d. The rollers 374 d makes contact with the first mothersubstrate 10.

[0354] The unfilled region detector 375 faces the back light unit 373.

[0355] The unfilled region detector 375 detects second light 375 a andthird light 375 b. When the first light 374 a passes through the liquidcrystal, the first light 374 a is transformed into the second light 375a. When the first light 374 a passes through the unfilled region, thefirst light 374 a is transformed into the third light 375 b.

[0356] The second light 375 a has different luminance and differentcolor in comparison with the third light 375 b. Therefore, the secondlight 375 a and the third light 375 b may be detected by the luminanceand the color.

[0357] A charge coupled device camera (CCD camera) may be used as theunfilled region detector 375. The charge coupled device camera receivesthe second light 375 a and the third light 375 b, generates an analogimage, and transforms the analog image into image data. The image dataare stored in the data storage module 377 of the control unit 378.Hereinafter, the image data detected from an assembled substrate that isbeing inspected is referred to a detected data. Hereinafter, the imagedata detected from the assembled substrate that has no unfilled regionis referred to as reference data.

[0358] The comparing unit 376 compares the detected data with thereference data.

[0359] The reference data do not include data that are obtained from thethird light 375 b. When an assembled substrate has unfilled region,detecting data detected from the assembled substrate includes data thatare obtained from the second light 375 a and data that are obtained fromthe third light 375 b.

[0360] The comparing unit 376 compares the detected data stored in thedata storage module 377 with the reference data. When the detected datais substantially equal to the reference data, the comparing unit 376concludes that the assembled substrate has no unfilled region. When thedetected data are different from the reference data, the comparing unit376 concludes that the assembled substrate has unfilled region.

[0361] When the detecting procedure is finished, the assembled substrateis erected to be disposed in parallel with the gravitational forcedirection and transferred by an automatically guided vehicle (AGV) ormanually guided vehicle (MGV) to a non-contact inspecting device thatinspects the liquid crystal display unit cell.

[0362] Referring again to FIG. 1, when the liquid crystal is supplied(step S500), the liquid crystal display unit cell is inspected, whetherthe liquid crystal display unit cell is normal or not (step S400) beforethe liquid crystal display unit cell is separated from the first mothersubstrate 10 and the second mother substrate 80.

[0363] In general, the liquid crystal display unit cell is inspected,whether the liquid crystal display unit cell has defects or not, afterthe liquid crystal display unit cell is separated from the first mothersubstrate 10 and the second mother substrate 80.

[0364] However, in the present invention, the sequence is changed.According to the exemplary embodiment of the present invention, theliquid crystal display unit cell is inspected, whether the liquidcrystal display unit cell has defects or not, before the liquid crystaldisplay unit cell is separated from the first mother substrate 10 andthe second mother substrate 80.

[0365] It may be hard to inspect the liquid crystal display unit cellbefore the liquid crystal display unit cell is separated, because inputterminal for receiving a signal that drives the liquid crystal displayunit cell is disposed between the first mother substrate 10 and thesecond mother substrate 80.

[0366] Hereinafter, a method of examining the liquid crystal displayunit cell by applying a test signal to the input terminal disposedbetween the first mother substrate and the second mother substrate willbe explained.

[0367]FIG. 30A is a flow chart showing a non-contact inspecting methodof inspecting the liquid crystal display unit cell.

[0368] Referring to FIG. 30A, in order to drive the liquid crystaldisplay unit cell, photoelectro-motive force is applied to the liquidcrystal display unit cell (step S410).

[0369]FIG. 30B is a flow chart showing a method of driving the liquidcrystal display unit cell of FIG. 30A.

[0370] Referring to FIGS. 3, 6 and 30B, the first light is applied to agate line, so that a first photoelectro-motive force is applied to thegate line 50 of the thin film transistor unit cell 50 (step S412). Thesecond light is applied to a data line, so that a secondphotoelectro-motive force is applied to the data line 60 of the thinfilm transistor unit cell 50 (step S414). A third light may be applied,so that a third photoelectro-motive force is applied to a commonelectrode (not shown) of the color filter unit cell 100 (step S416).

[0371] The first photoelectro-motive force may be applied to at leasttwo gate lines 50, simultaneously. The first photoelectro-motive forcemay be applied to one of the gate lines 50. The firstphotoelectro-motive force is large enough to turn on the thin filmtransistor 40. However, the first photoelectro-motive force is not toolarge to damage the channel layer 48 of the thin film transistor 40.

[0372] The second photoelectro-motive force may be applied to at leasttwo data lines 60, simultaneously. Alternatively, the secondphotoelectro-motive force may be applied to one of the data lines 60.The second photoelectro-motive force is applied to the source electrode44 of the thin film transistor 40. The second photoelectro-motive forcemay be differently applied to each of the data lines 60 so as to displaya test image.

[0373] The third photoelectro-motive force may be applied to the commonelectrode 120 of FIG. 6. A magnitude of the third photoelectro-motiveforce is different from those of the first photoelectro-motive force andthe second photoelectro-motive force.The third photoelectro-motive forcemay be connected to an earth potential. When the thirdphotoelectro-motive force is connected to the earth potential, the thirdlight may not be applied.

[0374] When the first photoelectro-motive force is applied to the gateline, the thin film transistor 40 is turned on. Then, the secondphotoelectro-motive force that is applied to the data lines 60 istransferred to the pixel electrode 70, so that alignment of the liquidcrystal molecules disposed between the pixel electrode 70 and the commonelectrode 120 is changed. When the alignment of the liquid crystalmolecules disposed between the first mother substrate 10 and the secondmother substrate 80 is changed, the light that passes through the liquidcrystal display device is transformed into the test image.

[0375] By the test image, the liquid crystal display unit cell isinspected, whether the liquid crystal display unit cell is normal or not(step S420).

[0376]FIG. 30C is a flow chart showing a method of inspecting the liquidcrystal display unit cell of FIG. 30A.

[0377] Referring to FIGS. 30A and 30C, the charge coupled device (CCD)camera detects the test image and transforms the test image into imagedata (step S422). The liquid crystal display unit cell determineswhether the liquid crystal display unit cell is normal or not (stepS430) by comparing the image data with reference data (step S424).

[0378] When the liquid crystal display unit cell is not normal, theliquid crystal display unit cell marked as abnormal unit cell to showthat liquid crystal display unit cell is not normal.

[0379] As described above, the liquid crystal display unit cell isinspected whether the liquid crystal display unit cell is normal or notby non-contact alignment method, in order to attach polarizing plateonly to a normal liquid crystal display unit cell.

[0380]FIG. 31 is a schematic view showing an example of a non-contactinspecting device.

[0381] Referring to FIG. 3 and FIG. 31, an inspecting device 380includes a base body 390, a photoelectro-motive force applying part 400,a display light applying part 410, a detector 420 and a control unit430.

[0382] The first mother substrate 10 and the second mother substrate 80where the liquid crystal display unit cell is formed are loaded on (orunloaded from) the base body 390.

[0383] The photoelectro-motive force applying part 400 includes a firstphotoelectro-motive force applying part 402, a secondphotoelectro-motive force applying part 404 and a thirdphotoelectro-motive force applying part 406.

[0384] The first photoelectro-motive force applying part 402 applies afirst photoelectro-motive force to the gate line 50 of the thin filmtransistor unit cell 30 to turn on the thin film transistor 40. Thefirst photoelectro-motive force may be applied to at least two gatelines 50 simultaneously or one gate line 50.

[0385] The second photoelectro-motive force applying part 404 applies asecond photoelectro-motive force to the data line 60 of the thin filmtransistor unit cell 30 so as to apply the second photoelectro-motiveforce to the source electrode 44. The second photoelectro-motive forceis transferred to the pixel electrode 70 via the drain electrode 46.

[0386] Referring to FIG. 6 and FIG. 31, the third photoelectro-motiveforce applying part 406 applies a third photoelectro-motive force to thecommon electrode 120 of the color filter unit cell. Then, electric fieldis formed between the common electrode 120 and the pixel electrode ofFIG. 3 to change an alignment of the liquid crystal molecule.

[0387] However, when a display light 411 is absent, an operation of theliquid crystal display unit cell may not be perceived.

[0388] The display light applying part 410 applies the display light 411that advances toward the first mother substrate 10.

[0389] The detector 80 detects a test image 412. When the display light411 passes through the first mother substrate 10, a liquid crystaldisposed on the first mother substrate 10 and the second mothersubstrate 80, the display light 411 is transformed into the test image412. The detector 420 transforms an analog signal into a digital signal.For example, a charge coupled device (CCD) camera may be used as thedetector 420.

[0390] The control unit 430 examines the operation of the liquid crystaldisplay unit cell by comparing the digital signal with reference signal.

[0391] When the liquid crystal display unit cell is examined whether ornot the liquid crystal display unit cell is normal, the assembledsubstrate is erected and transferred to next procedure of attaching apolarizing plate to the liquid crystal display unit cell that is normal.

[0392]FIG. 32 is a schematic view showing an example of an attachingdevice for attaching a polarizing plate to the liquid crystal displayunit cell.

[0393] Referring to FIG. 32, an attaching device 440 includes a basebody 450, a first polarizing plate attaching module 460, a secondpolarizing plate attaching module 470, a first cutting out module 480, asecond cutting out module 490, a first protection sheet strip module 500and a second protection sheet strip module 510.

[0394] The base body 450 provides a space where the first polarizingplate attaching module 460, the second polarizing plate attaching module470, the first cutting out module 480, the second cutting out module490, the first protection sheet strip module 500 and the secondprotection sheet strip module 510 are installed.

[0395] For example, the base body 450 may have a box shape. Alongitudinal direction of the base body 450 is referred to as anx-direction, and a lateral direction of the base body 450 is referred toas a y-direction.

[0396] An assembled substrate loader 520 is formed on the base body 450.An assembled substrate that is inspected whether or not the assembledsubstrate is normal is loaded on the assembled substrate loader 520.

[0397] A first polarizing plate loader 530 and a second polarizing plateloader 540 are disposed on the base body 450. The first polarizing plateloader 530 and the second polarizing plate loader 540 are spaced apartfrom the assembled substrate loader 520. The first polarizing plateloader 530 and the second polarizing plate loader 540 are parallel witheach other, and disposed in the y-direction.

[0398] The first polarizing plate has substantially an equal size to theassembled substrate. The first polarizing plates that are attached ontothe thin film transistor unit cell are loaded on the first polarizingplate loader 530.

[0399]FIG. 33 is a cross-sectional view showing a first motherpolarizing plate.

[0400] Referring to FIG. 33, a first mother polarizing plate 534includes a first base film 531, a first polarizing plate 532 and a firstprotection sheet 533.

[0401] The first mother polarizing plate 534 may have a smaller sizethan the assembled substrate. For example, the liquid crystal displayunit cell is arranged in a 3×2 matrix shape, the first mother polarizingplate 534 may have an enough size to form three first polarizing plate532 or two first polarizing plate 532.

[0402] Referring again to FIG. 32, the second polarizing plate has asubstantially equal size to the assembled substrate. The secondpolarizing plates that are attached onto the color filter unit cell areloaded on the second polarizing plate loader 540.

[0403] The second mother polarizing plate 544 may have a smaller sizethan the assembled substrate. For example, the liquid crystal displayunit cell is arranged in a 3×2 matrix shape, the second motherpolarizing plate 544 may have an enough size to form three firstpolarizing plate 532 or two first polarizing plate 532.

[0404]FIG. 34 is a cross-sectional view showing a second motherpolarizing plate.

[0405] Referring to FIG. 34, a second mother polarizing plate 544includes a second base film 541, a second polarizing plate 542 and asecond protection sheet 543.

[0406] Referring again to FIG. 32, a first cutting out module 480 and asecond cutting out module 490 are formed on the base body 450.

[0407] The first cutting out module 480 is disposed adjacent to thefirst polarizing plate loader 530. The second cutting out module 490 isdisposed adjacent to the second polarizing plate loader 540.

[0408] The first cutting out module 480 cuts out the first motherpolarizing plate in accordance with a size of the thin film transistorunit cell. The first cutting out module 480 cuts out the first motherpolarizing plates 534, such that a number and a size of the first motherpolarizing plates 534 are equal to a number and a size of the thin filmtransistor unit cells. The first cutting out module 480 may cut out thefirst mother polarizing plates 534, which are included in one column oron row of the thin film transistor unit cells arranged in a matrixshape.

[0409] The second cutting out module 490 cuts out the second motherpolarizing plate in accordance with a size of the color filter unitcell. The second cutting out module 490 cuts out the second motherpolarizing plates 544, such that a number and a size of the secondmother polarizing plates 544 are equal to a number and a size of thethin film transistor unit cells. The second cutting out module 490 maycut out the second mother polarizing plates 544, which are included inone column or on row of the thin film transistor unit cells arranged ina matrix shape. FIG. 35 is a schematic view showing an example of afirst cutting-out module of FIG. 32.

[0410] Referring to FIG. 35, a first cutting out module 480 includes anx-axis blade module 481 and a y-axis blade module 486.

[0411] The x-axis blade module 481 includes a first x-axis blade 482 anda first x-axis blade driving unit 483. The length of the first x-axisblade 482 is equal to an x-direction length of the thin film transistorunit cell. The first x-axis blade driving unit 483 pushes and pulls thefirst x-axis blade 482, such that a first protection sheet 533 and afirst polarizing plate 532 are completely cut and a portion of a firstbase film 531 is cut.

[0412]FIG. 36 is a schematic view showing a first (or second) motherpolarizing plate cut out by a first x-axis blade of FIG. 35.

[0413] Referring to FIG. 36, a first mother polarizing plate 534 is cutby the first x-axis blade module 481 of FIG. 35.

[0414] Referring again to FIG. 35, the y-axis blade module 486 includesa first y-axis blade 484 and a first y-axis blade driving unit 485. Thelength of the first y-axis blade 484 is equal to an y-direction lengthof the thin film transistor unit cell. The first y-axis blade drivingunit 485 pushes and pulls the first y-axis blade 484 such that a firstprotection sheet 533 and a first polarizing plate 532 are completely cutand a portion of a first base film 531 is cut.

[0415]FIG. 37 is a schematic view showing a first (or second) motherpolarizing plate cut out by a first y-axis blade after cut out by thefirst x-axis blade of FIG. 35.

[0416] Referring to FIGS. 33 and 37, a first mother polarizing plate 534is cut by the first y-axis blade module 486 of FIG. 35 so that a firstpolarizing plate 532 of the first mother polarizing plate 534 is cut tohave a substantially equal size to the thin film transistor unit cell.

[0417] Referring again to FIG. 32, the second cutting out module 490 hasan equal element with the first cutting out module 480. Therefore, anexplanation of the second cutting out module 490 is omitted.

[0418] The first protection sheet strip module 500 and the secondprotection sheet strip module 510 are formed on the base body 450. Thefirst protection sheet strip module 500 is disposed adjacent to thefirst cutting out module 480. The second protection sheet strip module510 is disposed adjacent to the second cutting out module 490.

[0419]FIG. 38 is a schematic view showing a first protection-sheet stripmodule of FIG. 32.

[0420] Referring to FIG. 38, a first protection sheet strip module 500strips a first protection sheet 533 a that is attached on the firstpolarizing plate 532 a, after the first protection sheet 533 and thefirst polarizing plate 532 of FIG. 33 are cut by the first cutting outmodule 480 of FIG. 32.

[0421] The first protection sheet strip module 500 includes a picker 501and a picker driving module 503.

[0422] The picker driving module 503 pushes the picker 501 such that thepick 501 makes touch with the first protection sheet 533 a.

[0423] The picker 501 absorbs the first protection sheet 533 a by meansof vacuum pressure. Then, the picker driving module 503 pulls the picker501. When the picker 501 absorbs the first protection sheet 533 a morestrongly than the adhesive power that combines the first protectionsheet 533 a with the first polarizing plate 532 a, the first protectionsheet 533 a is detached from the first polarizing plate 532 a.

[0424] When the first protection sheet 533 a is detached from the firstpolarizing plate 532 a, the first polarizing plate is attached on thethin film transistor unit cell of the liquid crystal display unit cell.

[0425] Referring again to FIG. 32, the second protection sheet stripmodule 510 has equal elements to the first protection sheet strip module500. Therefore, an explanation of the second protection sheet stripmodule 510 is omitted.

[0426] A first turning over module 560 and a second turning over module570 are formed on the base body 450. The first turning over module 560is disposed adjacent to the first protection sheet strip module 500. Thesecond turning over module 570 is disposed adjacent to the secondprotection sheet strip module 510.

[0427] The first turning over module 560 and the second turning overmodule 570 turn over the first mother polarizing plate and the secondmother polarizing plate respectively, such that an exposed firstpolarizing plate of the first mother polarizing plate faces the thinfilm transistor unit cell and an exposed second polarizing plate of thesecond mother polarizing plate faces the color filter unit cell.

[0428] The first polarizing plate attaching module 460 and the secondpolarizing plate attaching module 470 are formed on the base body 450.The first polarizing plate attaching module 460 is disposed adjacent tothe first turning over module 560. The second polarizing plate attachingmodule 470 is disposed adjacent to the second turning over module 570.

[0429] The first polarizing plate attaching module 460 attaches thefirst mother polarizing plate on the assembled substrate. The secondpolarizing plate attaching module 470 attaches the second motherpolarizing plate on the assembled substrate.

[0430]FIG. 39 is a schematic view showing a polarizing plate attachingmodule of FIG. 32.

[0431] Referring to FIG. 39, a first polarizing plate attaching module460 includes a first assembled substrate supporting unit 461 and thefirst polarizing plate attaching unit 466.

[0432] The first assembled substrate supporting unit 461 supports anassembled substrate 85. The first assembled substrate supporting unit461 includes a first assembled substrate supporting plate 462 and afirst assembled substrate absorbing part 463.

[0433] The first assembled substrate supporting plate 462 includes aplurality of first penetration holes 462 a.

[0434] The first assembled substrate absorbing part 463 includes a firstvacuum pipe 463 a and a first vacuum generating member 463 b. A firstend of the first vacuum pipe 463 a is connected with the firstpenetration hole 462 a of the first assembled substrate supporting plate462, and a second end of the first vacuum pipe 463 a is connected withthe first vacuum generating member 463 b. The first vacuum generatingmember 463 b forms a substantially vacuum state, so that the assembledsubstrate 85 is fixed to the first assembled substrate supporting plate462.

[0435] The first polarizing plate attaching unit 466 includes a firstpushing plate 468 and a first pushing plate driving module 467.

[0436] The first pushing plate driving module 467 pushes the firstpushing plate 468 so that a first polarizing plate 532 a of a firstmother polarizing plate 534 makes contact with the thin film transistorunit cell (not shown) of the first mother substrate 10. Therefore, thefirst polarizing plate 532 a that is cut by the first cutting out module480 of FIG. 32 is attached on the thin film transistor unit cell (notshown) of the first mother substrate 10.

[0437] Referring again to FIG. 32, the second polarizing plate attachingunit 470 is equal to the first polarizing plate attaching unit 460.Therefore, an explanation of the second polarizing plate attaching unit470 is omitted.

[0438] A third tuning over module 580 is disposed between the firstpolarizing plate attaching module 460 and the second polarizing plateattaching module 470.

[0439] The third tuning over module 580 turns over the assembledsubstrate on which the first polarizing plate is attached in order thatthe second polarizing plate may be attached on color filter unit cell.

[0440] When the first polarizing plate is attached on the thin filmtransistor unit cell and the second polarizing plate is attached on thecolor filter unit cell, a transferring arm transfers the assembledsubstrate to an assembled substrate unloading module 590. Two assembledsubstrate unloading modules 590 are formed

[0441] Referring again to FIG. 1, when the first polarizing unit cell isattached on the thin film transistor unit cell of the assembledsubstrate and the second polarizing unit cell is attached on the colorfilter unit cell of the assembled substrate, the liquid crystal displayunit cell is separated from the assembled substrate by non-contactmethod using laser beam or by contact method using diamond blade (stepS500).

[0442] The liquid crystal display unit cell that is separated from theassembled substrate is referred to as a liquid crystal display panel.

[0443] A flexible tape carrier package (TCP) and a printed circuit board(PCB) is attached onto the liquid crystal display panel so as tomanufacture a liquid crystal display panel assembly (step S600).

[0444] The liquid crystal display panel assembly is combined with a backlight assembly, so that a liquid crystal display device is manufactured.

[0445] While the exemplary embodiments of the present invention and itsadvantages have been described in detail, it should be understood thatvarious changes, substitutions and alterations can be made hereinwithout departing from the spirit and scope of the invention as definedby appended claims.

What is claimed is:
 1. A method of manufacturing a liquid crystaldisplay device, comprising: forming a plurality of thin film transistorunit cells on a thin film transistor unit cell region of a first mothersubstrate; forming a plurality of color filter unit cells on a colorfilter unit cell region of a second mother substrate; forming a liquidcrystal aligning member on the thin film transistor unit cells and onthe color filter unit cells; assembling the first mother substrate andthe second mother substrate to form an assembled substrate, such thatthe thin film transistor unit cells face the color filter unit cellsrespectively, and a liquid crystal layer is disposed between the thinfilm transistor unit cells and the color filter unit cells; applying atest driving signal to a plurality of liquid crystal display unit cellsvia a non-contact method to inspect the liquid crystal display unitcells, each of the liquid crystal display unit cells including a thinfilm transistor unit cell, a color filter unit cell facing the thin filmtransistor unit cell, and the liquid crystal layer; separating each ofthe liquid crystal display unit cells from the assembled substrate; andassembling a driving module with the liquid crystal display panel toform a liquid crystal display panel assembly, the driving module drivingthe liquid crystal display panel.
 2. The method of claim 1, wherein theliquid crystal aligning member is formed by: forming an alignment filmcomprised of an alignment material having a carbon-carbon double bond;and irradiating an atomic beam onto the alignment film at a first anglewith respect to the alignment film to transform the carbon-carbon doublebond into a carbon-carbon single bond having a polarized functionalgroup, and the first angle being substantially equals to a pre-tiltangle of liquid crystal molecules of the liquid crystal layer.
 3. Themethod of claim 2, wherein the atomic beam is irradiated onto thealignment film such that the atomic beam forms an angle in a range fromabout 0° to about 90° with respect to the alignment film.
 4. The methodof claim 3, wherein the alignment material is any one selected from thegroup consisting of diamond-like-carbon (DLC), SiO₂, Si₃N₄ and TiO₂. 5.The method of claim 1, wherein the assembled substrate is formed by:forming a fence on one of the thin film transistor unit cell and thecolor filter unit cell; filling the liquid crystal layer in a spacedefined by the fence; and assembling the first mother substrate and thesecond mother substrate.
 6. The method of claim 1, further comprising:applying a first light to the first mother substrate, the first lightpassing through the first mother substrate, the liquid crystal and thesecond mother substrate to be transformed into a second light; detectingthe second light to obtain unit cell data, each of the unit cell datacontaining a first image information of each of the liquid crystaldisplay unit cells; and comparing the liquid crystal cell data withreference data to detect an unfilled region where the liquid crystal isnot filled, the reference data containing a second image information ofthe liquid crystal display unit cell having no unfilled region.
 7. Themethod of claim 6, wherein the second light is detected by a chargecoupled device (CCD) camera.
 8. The method of claim 6, furthercomprising: exposing the assembled substrate at an atmospheric pressurefor a predetermined time when the unfilled region is detected.
 9. Themethod of claim 1, wherein the liquid crystal display unit cell isexamined by: applying a photoelectro-motive force as a test drivingsignal to each of the liquid crystal display unit cells; applying a testlight to the liquid crystal display unit cell, the test light beingtransformed into a test image while the test light passing through eachof the liquid crystal display unit cells; and inspecting the test imageto examine a display quality of each of the liquid crystal display unitcells.
 10. The method of claim 1, wherein the photoelectro-motive forceis formed by: applying a first light to a gate line formed in each ofthe thin film transistor unit cells to generate a firstphotoelectro-motive force; and applying a second light to a data lineformed in each of the thin film transistor unit cells to generate asecond photoelectro-motive force.
 11. The method of claim 10, whereinthe photoelectro-motive force is formed by further applying a thirdlight to a common electrode formed in each of the color filter unitcells to generate a third photoelectro-motive force.
 12. The method ofclaim 10, wherein the first photoelectro-motive force is higher than athreshold voltage of a thin film transistor connected to the gate line.13. The method of claim 9, wherein the test image is inspected by:detecting the test image to generate test image data; and comparing thetest image data with reference data.
 14. The method of claim 13, whereinthe test image is inspected by a charge coupled device (CCD) camera. 15.The method of claim 1, further comprising: attaching a first polarizingplate on the first mother substrate; and attaching a second polarizingplate on the second mother substrate, the first polarizing plate and thesecond polarizing plate being attached after examining the liquidcrystal display unit cells.
 16. The method of claim 1, wherein the firstand second mother substrates are erected to be disposed parallel to agravitational force direction and transferred so as to manufacture theliquid crystal display device after the thin film transistor unit cellsand the color filter unit cells are formed on the first and secondmother substrates, respectively.
 17. The method of claim 1, wherein anedge of each of the liquid crystal display unit cells is cut by a laserbeam, so that the liquid crystal display unit cells is separated intoeach of the liquid crystal display unit cells.